1. Field of the Invention

The present invention relates to computer cases, and particularly to a computer case with a blower for heat dissipating.

FOXCONN G31MV SERIES DRIVER UPDATES. Foxconn g31m, motherboards specifications. Foxconn n15235 supports, inf files prior. G31mx silent mode, million dollar traders part. Os installation. Hon hai precision industry co. Desktop computer. Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien, TW) Primary Class: 361/679.46. ScienBiziP, PC (Los Angeles, CA, US) Claims: What is claimed is: 1. A computer case, comprising: an air outlet communicating with within of the computer case; a blower configured to take heated air from within the computer case out.

2. Description of Related Art

Hon Hai Precision Industry Co., Ltd. Provides technology solutions in Japan, Ireland, the United States, Europe, Singapore, China, Hong Kong, and internationally. Installation of computer. Hon Hai Precision Industry Co., Ltd. Provides electronic manufacturing services for computers, communications, and consumer electronic products. The Company's business operations include desktop. Hon Hai Precision Industry Co., Ltd. Engages in the design, development and manufacturing of nanotechnology, heat transfer, wireless connectivity and material sciences products. Its products include cables, connectors, and personal computer components.

Even as computers become ever smaller they also increase in functionality, and the increasing density of components in computers increase the need for better heat dissipation. Typically, heat dissipation of the computer system is achieved by a system fan. However, this method has become inefficient for dissipating heat in the new modern high-power computer systems.

What is desired, therefore, is a computer case which suits a requirement of heat dissipation in a high-power computer system.

An exemplary computer case includes an air outlet, a blower configured to draw heated air from within the computer case via the air outlet, and a bracket configured for receiving the blower and mounted together with the blower on the outside of the computer case. The blower includes an intake facing the air outlet and a blower outlet. The heated air comes into the blower through the intake and is expelled through the blower outlet.

Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

FIG. 1 is an isometric view of a computer case in accordance with an embodiment of the present invention, the computer case including a heat dissipating assembly and a back plate;

FIG. 2 is an exploded, isometric view of the heat dissipating assembly and the back plate of FIG. 1;

FIG. 3 is an assembled, isometric view of the heat dissipating assembly of FIG. 2; and

FIG. 4 is an isometric view of a bracket of FIG. 2, but viewed from another aspect.

Referring to FIG. 1, a computer case 5 in accordance with an embodiment of the present invention includes a heat dissipating assembly 1, and a back plate 50 configured for mounting the heat dissipating assembly 1 thereon.

Referring also to FIG. 2, the back plate 50 includes an air outlet 52 with a plurality of heat dissipating holes defined therein, and a plurality of mounting holes 54 defined therearound. Cac card reader software download.

Referring to FIGS. 3 and 4, the heat dissipating assembly 1 includes a blower 10, and a bracket 20. The blower 10 includes two mounting holes 12 defined in its shell, an outlet 14, and an intake 16. The bracket 20 is configured for receiving and protecting the blower 10, and helps reduce noise leakage. The bracket 20 is box-shaped with an open side and includes a rectangular bottom plate and four sidewalls integrally perpendicularly extending from four edges of the bottom plate. An opening 24 is defined in one of the sidewalls, and a bent portion 27 is bent in from an edge of the one sidewall bounding the opening 24. A tab 23 is formed at a top corner of each two adjoining sidewalls, and a mounting hole 25 is defined in the tab 23. Two mounting holes 22 are defined in the bottom plate.

In assembling the heat dissipating assembly 1, the blower 10 is put into the bracket 20 and fixed in the bracket 20 by two screws 30 inserted through the corresponding holes 22 of the bracket 20 and screwed in the corresponding holes 12 of the blower 10, with the intake 16 of the blower 10 being exposed. The outlet 14 of the blower 10 is aligned with the opening 24 of the bracket 20 and the bent portion 27 of the bracket 20 abuts against a side wall of the blower 10 bounding the outlet 14. In mounting the heat dissipating assembly 1 to the back plate 50, three screws 40 are respectively inserted in the corresponding holes 54 of the back plate 50 and the holes 25 of the bracket 20 in order to mount the heat dissipating assembly 1 to the air outlet 52 at the outside of the computer case 5. The outlet 14 of the blower 10 faces down, and the intake 16 of the blower 10 faces and communicates with the air outlet 52.

In use, heated air from within the computer case 5 is taken out by the heat dissipating assembly 1.

It is believed that the present embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Letter from CEO

I am Jack, CEO of MIH. Thank you for joining the MIH Alliance to jointly build an Electric Vehicle (EV) open platform to accelerate the innovation and development of the EV industry. Since the introduction of MIH, we have received great feedback from around the world, and here are what you can expect in the coming months.

MIH Overview

Hon Hai Precision Ind Co Ltd Device

Drivers Hon Hai Precision Ind Laptops & Desktops 10

There are three major challenges facing the traditional automotive industry: high development costs, long lead times and insufficient resources. In response to these challenges, we built an open Electric Vehicle (EV) platform, called MIH which is available to all partners and third-party developers to utilize as they develop functional attributes and systems that will support the growth of the whole EV market. It provides developers with the essential hardware and software components to build upon, in the formation of a complete EV industry ecosystem.
The MIH platform has four key characteristics:
1. Its architecture is fully modularized, scalable, and easily customizable
2. The chassis is made with the latest lightweight material, with a unibody design that would optimize the EV’s performance
3. It provides a powerful electrical architecture for all levels of applications
4. This platform will allow for the development of autonomous driving technologies